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Keyword [electronic packaging]
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1. 1.Molecular Dynamics Simulation For The Vibration Characteristics Of Nonlinear Optical Material BBO 2.Reliability Research On Flip Chip Electronic Packaging
2. Development Of Lead Free Solder And Its Interfacial Issues In Electronics Packaging
3. Transient Contact Liquid-Solid Reaction Of Solder Droplet/Pad And Interfacial Microstructure Evolution
4. Preparation Of SiCp/Al Composites And Electronic Device Fabrication
5. Microstructure And Properties Of SiCp/Cu Composites For Electronic Packaging
6. Study On Damage Constitutive Model And Failure Mechanism Of Lead-Free Solder In Microelectronic Packaging
7. Wetting Dynamics Of Solders In SMT
8. Interfacial Evolution And Reliability Of Lead-Free Solder Joints For Electronic Packaging
9. Study On Conducting Polypyrrole Films For Electromagnetic Interference Shielding
10. Study On The Preparation And Properties Of Electronic Packaging Composite Materials With Controllable Thermal Expansion Coefficient
11. Study On Synthesis And Performances And Of Epoxy Resin Materaials Used In Elexctronic Packaging
12. Study On The Nickel Micro-nanocones Array Materials Fabricated By Electrodeposition
13. Study On Nano - Materials In Electronic Packaging Interconnection And Heat Dissipation
14. High Temperatures Of Lead-free Solder Surface Mount Solder Joint Reliability
15. Thermophysical Properties Of Aluminum Infiltrated Silicon Carbide For Electronic Packaging
16. Study On Thermodynamics Behavior Of SMT Solder Joints
17. Study On The Process Of W/Cu Composites With Low CTE And High TC Used For Electronic Packaging
18. Composites With Low CTE And High TC Used For Electronic Packaging--The Investigation On The Preparation And Properties Of NTE ZrV2O7 And ZrV2O7/Al Composite Materials
19. Pressureless Infiltration Of SiCp/Al Electronic Packaging Materials With Particles Of Bimodal Size Distribution
20. Microstructure And Properties Investigation Of SiCp/Cu Composites
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