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Keyword [interface bonding]
Result: 41 - 60 | Page: 3 of 9
41.
Forming Mechanism And Experimental Study Of Recycled Pp/Rubber Powder/Wood Powder Composite Material
42.
Preparation And Properties Of Ti
3
AlC
2
-La
2
O
3
/Cu Composites
43.
Preparation And Properties Of CNTs/Cu Composites
44.
Wetting And Adhesion At AI/MgAl
2
O
4
Interfaces And The Effect Of Substrate Crystallographic Orientation
45.
Study Of Interface Bonding And Its Performance Of Copper Clad Steel Composite Wire
46.
Study On Integral Casting Process For Copper Water Jacket By Embeding Cu-Ni-Nb Copper Pipe Based On ProCAST
47.
Study On The Continuous Rheo-rolling Process Of A356-B
4
C Composite
48.
Study Of The Metal Cladding Onto Carbon Fibers And The Characteristics Of Interface Bonding Of Metal-coated Carbon Fibers
49.
Interfacial Enhancement Effect On Spark Plasma Sintering Process Of Fe-based Amorphous
50.
First-principles And Experimental Study On The Effect Of Alloying Element And Interface Phase Al
4
C
3
On The SiC/Al Interface
51.
Research On The Interface Feature, Microstructures And Performance Of Biomedical PLA/Mg Composites
52.
Microstructure And Properties Of Tungsten Coated Diamond/Aluminum Composites
53.
Mechanisms For Ultrasonic Assisted Wetting Of Liquid Sn To Zr-based Amorphous Alloy And Bonding Strength Examination
54.
Bonding Mechanism And Microstructure Characteristics In An Explosively Welded Al/Mg Alloy
55.
Study On Fabrication And Mechanical Properties For Bimetal Using Spray-forming Al-22Si/Cast Aluminum
56.
Impregnation Simulation And Optimization Study Of Continuous Fiber Reinforced Thermoplastic Composite Materials
57.
Research On The Impregnation Mechanism Of Glass Fabirc/Polypropylene Composites And Interface Bonding Performance
58.
Study On Microstructure And Properties Of Ni60/WC Coating Based On Composite Surface Strengthening Technology
59.
The Effect Of First Reduction Ratio On The Interfacial Bonding Rate Of Stainless Steel Clad Plate And The Microstructure Simulation
60.
Research Of Debonding Flaws Of Multi-layered Interface Bonding Structure Based On The Ultrasonic Testing
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