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Keyword [interfacial IMC]
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1. Study On The Electromigration Behavior And Inhibition Mechanism Of SnBi Solder
2. Research On Creep Behavior Of The Miniature Lead-free Solder Joints Under The Condition Of Multi-field Coupling
3. Optimization Of Flux For Sn-Cu Hypoeutectic Solder And Interfacial IMC In Solder Joints
4. Comparative Study On SnAgCuBiNi And SAC305Lead-free Solder
5. The Study Of Effect Of Nanoparticles On Sn-Cu Hypoeutectic Solder
6. Research On Electromigration Behavior Of Solder Joints In Coupling Thermal-electric Stress
7. Study On Electromigration Of Sn2.5Ag0.7Cu0.1RE/Cu Brazed Joints Under Thermal Cycling
8. Effect Of Thermomigration On The Microstructure And Mechanical Properties Of Micro-joints
9. Research On Interfacial Fractureing Behaviors And Adjusted Method Of IMC Layer For The Laser Welded–brazed Al/Steel
10. Research On Micro-structure And Creep Of Solder Joint Under Thermomigration
11. Growth And Evolution Behavior Of Interfacial IMC In Cross-scale Sn-Ag-Cu/Cu Micro Solder Joints And Their Mechanical Properties
12. Growth And Evolution Of The Interfacial IMC In Cu/Sn/Cu Micro Joints During Isothermal Reflow
13. Microstructure And Mechanical Property Regulation Of Dual-spot Laser Welded-brazed TC4/6061 Dissimilar Metals Joint
14. Investigation On The Effect Of Alloying Element Addition On Growth Of Sn5Zn/Cu Interfacial Imc And Properties Of Joint
15. Study On Interfacial IMC Growth Mechanism Of High P Content Co-P/SAC/Co-P Solder Joint Induced By Temperature Gradient
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