intermetallic compound - Globe Thesis

Keyword [intermetallic compound] Result: 161 - 180 \| Page: 9 of 10
161.	Interfacial Reaction Between Electroless NiPdAu Surface Finish And SnAgCu Solder And BGA Solder Joint Reliability
162.	Research On The Mechanical Properties And Constitutive Equations Of Tial-based Alloy
163.	The Influence Of Temperature On Diffusion Behavior And Microstructure Properties Of Ni-Ti Cold Spray Layer
164.	Interfacial Reaction And Electromigration Of SnZnBi-χNi Lead-free Solders And Cu Substrate
165.	Effects Of Zn On The Interfacial Reaction And Electromigration Reliability Of Sn-Bi Lead-free Solder
166.	Study On The Interface Diffusion Process Of Cold Rolling Cu/Al Clad Metal Sheet In Annealing Process
167.	Aluminum Alloy/stainless Steel Rolling Composite Technology And Interface Reaction Research
168.	Structure And Electromagnetic Transport Properties Of R-T-M1:2:2and The Exploratory Study Of R-Ga1:3Intermetallic Compound Phase Rule
169.	The Preparation Of Porous Niobium And Its Infiltration With Ti-Al Intermetallic Compound
170.	Effects Of Si Addition On The Growth Behavior Of Intermetallic Compound Layer At Aluminum/steel Rolling Interface
171.	Research On The Interfacial Reactions And Reliability Between In-3Ag Low Temperature Solder And Copper Or Nickel Substrates
172.	The Simulation Calculation And Microstructural Performance Research Of Steel/Aluminum Powder Filler Laser Welding
173.	The Study Of Interface Morphology Change Of Micro Solder Joints During Aging And The Simulation Study Of Its Impact On Performance
174.	Study On Cracks And Microstructure Of Weld Zone Of TA15/Cr18-Ni8Steel Joints By Filler Wire GTAW
175.	Research On The Fabrication And Reliability Of Alloy Bumps Based On Multilayer Electroplating
176.	Interface Structure And Mechanical Performance Improvement Of Disimilar Friction-stir-welded Joint
177.	Study Of Intermetallic Compounds Growth Behavior And The Effects Of Mn Addition On Properties Of SnAgCu Solder
178.	Preparation Of Ni-Al Gradient Coating On The Surface Of Pure Cu
179.	Investigations On Interfacial Microstructures And Mechanical Properties Of Sn-3.0Ag-0.5Cu Solder/Cu Joints
180.	Study On Microstructure And Properties Of Ni-Al Intermetallic Compound Coating By Laser Cladding
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