Keyword [intermetallic compounds (IMC)] Result: 1 - 6 | Page: 1 of 1 1.  Transient Contact Liquid-Solid Reaction Of Solder Droplet/Pad And Interfacial Microstructure Evolution 2.  The Effects Of High Magnetic Field On The Growth Behaviors Of Tin-copper Intermetallic Compounds (IMC) Layers 3.  Failure Mechanism Of The Interface Between Ball Grid Array Solder And Cu Substrate Induced By Thermal/Current/Vibration Loading 4.  Optimization Of Flux For Sn-Cu Hypoeutectic Solder And Interfacial IMC In Solder Joints 5.  Mechanism Of Effect Of POSS Enhanced Particles On The Morphology Of Intermetallic Compounds In Sn3.5Ag/Cu Interface 6.  Effects Of Dual Beam Laser Welding Process On Microstructure And Mechanical Properties Of Steel/Aluminum Alloy Dissimilar Metal Joints   <<First  <Prev  Next>  Last>>  Jump to

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