Keyword [mechanical polishing] Result: 181 - 200 | Page: 10 of 10 181.  Investigation of slurry systems in metal and dielectric chemical mechanical polishing 182.  Chemical-mechanical polishing of metal and dielectric films for microelectronic applications 183.  Macroscopic and microscopic modelling in chemical-mechanical polishing (CMP) process 184.  Chemical Mechanical Polishing of Germanium and Indium Phosphide for Microelectronic Applications 185.  Multiscale modeling of the slurry flow and the material removal in chemical mechanical polishing 186.  Novel slurry formulations and associated mechanisms for chemical mechanical polishing of polysilicon, silicon dioxide and silicon nitride films in microelectronic applications 187.  A Study of the Colloidal Stability of Mixed Abrasive Slurries of Silica and Ceria Nanoparticles for Chemical Mechanical Polishing 188.  Characterization of chemical interactions during chemical mechanical polishing (CMP) of copper 189.  Classical molecular dynamics and ab initio simulations of chemical-mechanical polishing of amorphous silica 190.  Study of interfacial interaction during chemical mechanical polishing (CMP) of dielectric silicon dioxide 191.  Modeling of chemical mechanical polishing at multiple scales 192.  Chemical mechanical polishing (CMP) of sapphire 193.  Some chemical and electrochemical aspects of the chemical mechanical polishing of copper 194.  Synthesis and characterization of nanoporous silicon dioxide particulate for low defectivity in low-k dielectric chemical mechanical polishing 195.  Investigation of mechanical aspects of chemical mechanical polishing 196.  An investigation into chemical-mechanical polishing process of zinc selenide 197.  Investigation on Inter-layer Dielectric Processed by Chemical Mechanical Polishing and Spin-on Dielectric for Complementary Metal-oxide-semiconductor Compatible Device 198.  Mechanism of dissolution and planarization of copper/tantalum films during chemical-mechanical polishing 199.  Experiments and mechanistic models for the chemical-mechanical polishing of low dielectric constant polymers and organosilicate glasses 200.  Fundamental studies on silicon dioxide chemical mechanical polishing   <<First  <Prev  Next>  Last>>  Jump to

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