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Keyword [micro-bump joint]
Result: 1 - 2 | Page: 1 of 1
1.
Growth And Evolution Behavior Of Interfacial IMC In Cross-scale Sn-Ag-Cu/Cu Micro Solder Joints And Their Mechanical Properties
2.
Three-dimensional Simulation Of The Interaction Between The Micro-bump Joints And Cu Protrusion In Cu-filled TSVs And Its Effect On Reliability Of The Joints In 3D Integration
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