micro-solder joints - Globe Thesis

Keyword [micro-solder joints] Result: 1 - 20 \| Page: 1 of 2
1.	Evolution And Control Of Au-Sn Intermetallic Compounds In Laser Reflowed Micro-Solder Joints
2.	Interface Diffusion And Electromigration Regularity Of Cu/SnAgCu/Cu Micro Solder Joints Under Electro-thermal Coupling
3.	Study On Shear Properties Of SnAgCu Micro-solder Joints
4.	The Study Of Interface Morphology Change Of Micro Solder Joints During Aging And The Simulation Study Of Its Impact On Performance
5.	Study Of Modification And Mechanism Of Nano-particles On Sn58Bi/Cu Micro Solder Joints
6.	Study On Interfacial Reactions In Ni/Sn-xZn/Ni And Ni/Sn-xCu/Ni Micro Solder Joints Under Thermomigration
7.	In-situ Plasticity And Creep Behavior Of Cu/SAC/Cu Micro Solder Joints Under Variable Temperature
8.	Study On The Bonding And High Temperature Response Mechanism Of Sn₅Sb-xCuNiAg/Cu（Ni）Micro Solder Joints
9.	Design And Preparation Of Sn58Bi-xCu Solder And The Mechanism Of Influence On The Performance Of Micro Solder Joints
10.	Study On The Interfacial Reactions In Cu/Sn-xZn/Ni Micro Solder Joints
11.	Study On The Interfacial Evolution Of SAC305 Micro Solder Joints Based On The Diffusion Of Graphene Barrier Layer
12.	Growth And Evolution Behavior Of Interfacial IMC In Cross-scale Sn-Ag-Cu/Cu Micro Solder Joints And Their Mechanical Properties
13.	Investigation On Reliability Of High Current Density Micro Solder Joints Under Extreme Temperature
14.	Study On Reliability Of Sn-Bi Micro Solder Joints Under Thermal Migration
15.	Thermomigration In Cu/In-48Sn/Cu Micro Solder Joints And Its Effect On Soldering Interfacial Reactions
16.	Sn/ENIG Isothermal Aging And Electromigration Of Micro Solder Joints
17.	Effect Of Cu/Sn Content On The Properties Of IMC-Cu Composite Micro Solder Joints
18.	Interface IMC Evolution And Mechanical Properties Of Sn-5Sb-xCuNiAg/Cu Micro Solder Joints Under Temperature Cycling
19.	Microstructure Control Of β-Sn Grains And Interfacial Reactions In Sn-based Micro Solder Joints
20.	Research On Creep Properties Of Micro-solder Joints Under Thermo-electric Action
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