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Keyword [microelectronics packaging]
Result: 1 - 11 | Page: 1 of 1
1.
Microelectronics Packaging Line Sintering Of Nano-silver Conductive Adhesive Preparation And Research
2.
The Synthesis Of Cu Nanoparticles And Their Low Temperature Joining Behavior During Sintering
3.
Controlled fabrication of aligned carbon nanotube architectures for microelectronics packaging applications
4.
Electrical contact resistance of anisotropic conductive adhesive assemblies in microelectronics packaging
5.
A systems approach to the reduction of thermal resistance in microelectronics packaging
6.
Fabrication of metal matrix composite of copper and silicon for microelectronics packaging
7.
Isotropic copper-invar alloys for microelectronics packaging
8.
Synthesis and characterization of thermosetting polyimide oligomers for microelectronics packaging
9.
Selective laser sintering of aluminum nitride for microelectronics packaging
10.
Materials study for interfacial adhesion and reliability of microelectronics packaging structures
11.
Aluminoborophosphosilicate glasses for microelectronics packaging
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