Font Size: a A A
Keyword [package material]
Result: 1 - 13 | Page: 1 of 1
1. Research Of Epoxy Resin Filling Modified By Ultra-fine Aluminum Nitride
2. Study On The Process And Technology Of ABC Die Head Layers Super Speed Wide-breadth Biaxially Oriented Polyester
3. Study On The Abrasion Resistance Property Of BOPP Cigarette Packing Film
4. The Thermal Conductive Pathway In Epoxy Encapsulants For Electronic Packaging And Its Properties
5. Study On The Flexible Packaging Technology Of Rice Flour
6. Study On Superchilling Preservation Combined With Modified Atmosphere Packaging Of Pork
7. High Performance Epoxy Resin Using In Electronic Package Material: Synthesis And Properties Studies
8. Preparation And Foaming Of PLA-based Biodegradable Food Package Material Reinforced By NCC
9. Studyon The Controlled Atmosprhere Storage Technology Of Fresh Pork
10. The Forming Study Of Filling Equipments’ Package Material Based On Aluminum Foil
11. Research Of Annular Cement Package Material Used For Water Shut-off In Horizontal Wells Completed With Gravel Packing
12. Control Of Residual Impurity In Large Volume Injection Products Package
13. Process-induced residual stresses analysis in plastic-encapsulated integrated circuit packages
  <<First  <Prev  Next>  Last>>  Jump to