packaging applications - Globe Thesis

Keyword [packaging applications] Result: 1 - 20 \| Page: 1 of 2
1.	Preparation, Application Zein-cellulose Composite Films
2.	Study On Extraction Of Collagen From Tilapia Scale And Packaging Applications
3.	Preparation Of Cellulose-based Films For Packaging Applications
4.	Electromigration and thermomigration reliability of lead-free solder joints for advanced packaging applications
5.	An investigation of multilayer nanocomposite polypropylene film for food packaging applications
6.	Controlled fabrication of aligned carbon nanotube architectures for microelectronics packaging applications
7.	Performance properties of a biodegradable foam (Green Cell) for packaging applications
8.	Electrical and thermal characterization of carbon nanofibers for interconnect and packaging applications
9.	High performance UV-curable polymers and polymer-clay nanocomposite thin films for advance electronic packaging applications
10.	Continuous blending approach in the manufacture of epoxidized soybean-plasticized poly(lactic acid) sheets and films for packaging applications
11.	Functional properties and stability of PLLA-metal organic framework based mixed matrix membranes
12.	Surface modification of food contact materials for processing and packaging applications
13.	Diamond-based heat spreaders for power electronic packaging applications
14.	Evaluation of Natural Plant Powders with Potential Use in Antimicrobial Packaging Applications
15.	Development of polylactide-clay nanocomposites for food packaging applications
16.	Development of polylactic acid (PLA) based blends and their nanocomposites for packaging applications
17.	Development and Characterization of Thermally Conductive Polymeric Composites for Electronic Packaging Applications
18.	Blends of EVA and metallocene-catalyzed polyethylene copolymers for adhesive and film packaging applications
19.	Development of high reliability and high processability thermosets for electronic packaging applications based on ternary systems of benzoxazine, epoxy and phenolic resins
20.	Boron nitride-filled polybenzoxazine composites for electronic packaging applications
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