solder interface - Globe Thesis

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1.	The Effect Of Processing Property And Interface Behavior In The Joints Of The Sn-based Lead Free Solder With Additional Elements
2.	Effect Of Alloying Elements And Aging On Microstructure And Solder Interface Of Sn-Zn Lead-free Solders
3.	The Effect Of Structure And Coating On Electromigration Performance Of Sn3Ag0.5Cu Lead Free Solder Interface
4.	Studies On The Effects Of Zn On Interface Structure And The Corrosion Resistance Of The Sn/Al
5.	Study On Microstructure Of Sn-Au-Ag(Ni) Solders And Their Mechanical Properties On Cu And Ni Substrates
6.	Study On The Liquid Physical Properties Of Sn-0.7Cu Lead-free Solder And The Electrophoresis In The Melt
7.	Study On Sn-Zn Based Lead-free Solders For Soldering Al And Cu
8.	Study On Growth Behaviors Of Sn-Cu-Bi Lead-free Solder Interface IMCs
9.	Study On Reliability Of Sn-Bi Micro Solder Joints Under Thermal Migration
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