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Keyword [voids]
Result: 41 - 60 | Page: 3 of 5
41. Microstructure Evolution Of Tungsten Single-crystal Coating Serving Under Long Time At High Temperature
42. Effects Of Voids In Fruits And Vegetables On Ultrasound-Assisted Immersion Freezing
43. Molecular Dynamics Simulation Of Single Crystal Nano Copper With Voids
44. Fabrication Of Nanostructural SnO2 Based Composite Fibers For Li Storage Application
45. Mechanical Behaviors Of Nanostructured FCC Metals With Low Stacking Fault Energy
46. Mechanical Behavior Of Carbon Fiber Composite Laminates With Engineered Structural Defects
47. Research On Tensile Deformation Property Of Cu-Pb Alloy Based On Molecular Dynamics
48. Study On The Influence Law And Control Technology Of Voids Behind Wall On The Stability Of Brickwork Roadway
49. MD Study On The Interaction Of Grain Boundaries And Voids During The Plastic Deformation Of ?-TiAl Based Alloy
50. The Epitaxial Growth Of 3C-SiC Films On Si(110) Substrate By Laser CVD
51. Research On The Mechanism Of Compacting Voids In The Cross Wedge Rolling Shafts Based On The Floating-pressure Method
52. The Study On Hydrogen Diffusion And Hydrogen-induced Fatigue In Large Forgings Under Micro Views
53. Study On Diffusion Bonding Process Of Conformal Cooling Channel For Injection Mold
54. The Effect Of Electroplating Parameters On Copper Foil And Interfacial Voids Of Lead-free Solder Joints
55. Study On Ultrasonic Bonding Technology Based On Copper Micro-nanocones Arrays
56. Investigation Of The Effect Of Substrate Grian Refinement To Reaction Of Sn/Cu Interface
57. The Reliability Of ?5?m Cu/Sn High Density Microbump
58. Atomistic Simulation Of Edge Dislocation In BCC Iron Under The Serial Interaction Of Cu Precipitates And Voids
59. The Influence Of Void On Fracture Behaviour Of TiAl-Nb Alloys Using Molecular Dynamics
60. The Influence Of Interfacial Reaction And Kirkendall Void On The Copper Pillar Reliability In Three-demensional Electronic Packaging
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