Electronic packaging - Globe Thesis

Keyword [Electronic packaging] Result: 1 - 20 \| Page: 1 of 2
1.	Reliability Research On Electronic Packaging
2.	Moisture-proof Film Technology, High Reliability Electronic Packaging
3.	New Lightweight Low-expansion, High Thermal Conductivity Electronic Packaging Materials
4.	Study On The Dynamic Weighing System And Data Processing Methods Of Electronic Quantitative Packaging Machine
5.	Study On The Properties Of CNT-based Micro-Cooler For Heat Dissipation In Electronic Packaging
6.	The Studies On Preparation Proess, Structure And Properties Of High-silicon Aluminum Alloy For Light Weight Electronic Packaging
7.	Study On The Heat Dissipation Characteristics Of The Semiconductor Refrigeration Chip And The Heat And Moisture Properties Of The Package
8.	Fabrication Of A Hybrid Paste Of Microscale Ag-plated Cu Flakes And Nanoscale Ag Particles And The Properties Of The Hybrid Paste Sintered Joints
9.	The Fatigue Life Calculation Of The Electronic Packaging Structure Under Combined Thermal Stress And Vibration Loading Conditions
10.	The Analysis Of Missile Borne Electronic Packaging Structure Under Thermal-Mechanical Coupling
11.	Advances in electronic packaging technologies by ultra-small microvias, super-fine interconnections and low loss polymer dielectrics
12.	Solid and fluid mechanics case studies in advanced electronic packaging
13.	Development of a knowledge model for the computer-aided design for reliability of electronic packaging systems
14.	Parameter extraction for electronic packaging and decoupling methodology for power delivery systems
15.	Prediction and validation of thermomechanical reliability in electronic packaging
16.	Micro-mechanical evaluation of electronic packaging and a MEMS material
17.	Modularized and parametric modeling methodology for concurrent mechanical design of electronic packaging
18.	Finite element thermomechanical analysis of electronic packaging problems using disturbed state constitutive models
19.	A study of heat transfer enhancement for electronic packaging
20.	Research On Packaging Technology Of High Performance Thermoelectric Cooler
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