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Keyword [Flip Chip]
Result: 1 - 20 | Page: 1 of 2
1.
Anisotropic Conductive Adhesive And Its Application On The Packaging Of Radio Frequency Identification Tags
2.
Analysis Of Anisotropic Conductive Adhesive Interconnection Under Multi-factors Influence And Optimization For Its Performance
3.
Research On High Power DC/Dc Modular Power Supply
4.
Bumping Technology For MEMS Flip Chip Packaging
5.
Flexible Bumping Technology And Applications In MEMS Flip Chip Packaging
6.
Design And Simulation Of Pre-bonding System Of Flip Chip Equipment For RFID Packaging
7.
Force/Position Control And Application Based On Voice Coil Motor
8.
New Thermosonic Flip Bonding Power Drive System
9.
Large Storage Tank Hydraulic Flip Construction Project Management
10.
Design And Error Compensation Of Multi-DOF Flip-Chip Bonding Mechanisms
11.
Fabrication And Characterization Of Flip-Chip Power Light Emitting Diode With Different Number Of Au Stud Bumps
12.
Analyse And Simulation Of Vibration Isolation Of The Flip-chip Bonding Machine
13.
Quartz Vibrating Beam Accelerometer System Based On DETF
14.
Research On The Heat Dissipation Performance Of LED Flip Chip Filament Lamp
15.
Study On The Electroplating Tin Process For Packaging Of The MEMS Accelerometer
16.
Research On White LED Filament Based On Flip-chip
17.
Light Source Fabrication And Thermal Analysis Based On High Voltage Flip Chip LED Chips
18.
Design Of Structure And Fabrication Of High Luminous Efficiency GaN-Based Flip-Chip LEDs
19.
Basic Study On Ultrasonic Vibration Assisted Underfill Process For Flip-chip
20.
Research On Moistureproof Technology Of Non-hermeticity Flip Chip Devices For Aerospace Application
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