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Keyword [Underfill]
Result: 1 - 7 | Page: 1 of 1
1.
Reliability Research On Electronic Packaging
2.
Basic Study On Ultrasonic Vibration Assisted Underfill Process For Flip-chip
3.
Underfill selection methodology for component underfilling process
4.
Modeling and experiments of underfill flow in a large die with a non-uniform bump pattern
5.
Fluid dynamics and heat transfer considerations for gel thermal interface materials (Part 1) and the underfill process (Part 2)
6.
Fatigue life prediction of solder interconnects in area-array microelectronic packages and the effects of underfill
7.
Experimental Study of Novel Materials and Module for Cryogenic (4K) Superconducting Multi-Chip Modules
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