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Keyword [Current crowding]
Result: 1 - 9 | Page: 1 of 1
1.
Manufacturing Process Of Ultra-deep Sub-micron Aluminum Interconnect Electromigration Reliability
2.
Current Crowding For Cu Interconnects
3.
Analysis And Research On Failure Mechanism Of Nitride-based White LED
4.
Simulation Investigation Of The Effect Of Electrode Structure And COB Packaging On Thermal, Electrical And Optical Characteristics Of GaN-LED
5.
AlGaN/GaN Schottky Barrier Diode Atlas Simulation And Experimental Research
6.
Research On The Reliability Of Electromigration In Solder Bump Of Flip Chip Packaging Under Multi-physics Coupling
7.
Structure Design And Performance Research Of MCT Device Based On Schottky Contact
8.
Design And Fabrication Of Embedded-contact Vertical Structure LED Chips
9.
Effect of current crowding and device structure on operation of gallium nitride-based light-emitting diodes
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