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Keyword [Flip chip]
Result: 121 - 140 | Page: 7 of 9
121.
Flip chip testing with a capacitive coupled probe chip
122.
In-process stress analysis of flip chip assembly and reliability assessment during environmental and power cycling tests
123.
Material characterization of thin coatings and failure analyses of flip-chip packages
124.
Study on the curing process of no-flow and wafer level underfill for flip-chip applications
125.
Underfill adhesion characteristics, residual stresses and analysis of thermal stresses in flip-chip packages
126.
An experimental approach to develop process windows for lead-free flip chip assembly from a yield and reliability perspective
127.
Flip chip assembly in air from manufacturing and reliability perspectives
128.
Integrated flip-chip flex-circuit packaging for power electronics applications
129.
Development, modeling and characterization of flip-chip assembled silicon MEMS for RF applications
130.
New process development for flip chip assembly
131.
Reliability study and technology development of solder-bumped flip chip on low-cost substrate
132.
Enhanced performance of ultra-violet emitters by flip-chip packaging technique
133.
Study on adhesion of underfill materials for flip chip packaging
134.
Design and analyses of a dimple array interconnect technique for power electronics packaging
135.
Wafer-applied underfill for flip chip-on-laminate assembly
136.
A study on the reliability of flip chip solder joints
137.
Design rules for RF and microwave flip-chip
138.
Flip-chip fabrication of advanced microelectromechanical systems and integrated microsystems
139.
Issues in chip-package codesign using flip-chip and thin-film technologies
140.
Study on thermally reworkable underfills for flip chip, BGA, and CSP applications
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