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Keyword [Flip chip]
Result: 141 - 160 | Page: 8 of 9
141.
System implementation, modeling and defects pattern recognition for flip chip solder joint inspection using laser techniques
142.
Effects of temperature and moisture on durability of low cost flip chip on board (FCOB) assemblies
143.
RF modeling of flip -chip interconnects and MEMS in microwave /mm -wave circuits
144.
Interfacial adhesion and subcritical debonding of low-k dielectrics in flip-chip-packaged copper/low-k interconnect structures
145.
Study on no-flow underfill materials for low-cost flip chip applications
146.
Fuzzy logic-based regression models of flip-chip bonding processes
147.
Technology and compression modeling for thermosonic flip-chip bonding
148.
OSP (Organic Surface Protectant) evaluation for flip chip assembly and finite element correlation of failure mechanism
149.
Longitudinal thermosonic bonding for flip-chip assembly
150.
Design and fabrication of hybrid optical receiver for free space optical interconnections using flip-chip bonding
151.
Analysis and design of via and flip chip interconnects
152.
Experimental and modeling studies for thermosonic flip chip bonding
153.
Fluxless Bonding Processes Using Silver-Indium System for High Temperature Electronics and Silver Flip-Chip Interconnect Technology
154.
Study On Structure Design,process And Performance Of Wafer Level Copper Pillar Bump Packaging
155.
Research On Flip Chip Ultrasonic Scanning Detection And Image Reconstruction Method
156.
Servo System Position Control Of The Flip Chip Arms On A Flip Chip Bonder
157.
Self-Feedback Matching For Vision Alignment System In Wafer-Level Flip-Chip Packaging
158.
Research On Electro-migration Failure Of Flip Chip Under Electro-thermal-Structure Coupling
159.
Study On The Yield Improvement Of The Assembly Of Flip Chip Components
160.
Research On The Performance Of GaN-based HEMT And Its Optoelectronic Integrated Devices
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