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Keyword [Flip chip assembly]
Result: 1 - 9 | Page: 1 of 1
1.
The Interfacial Reaction Of Solder Joint For Flip Chip Assembly With Cu/OSP Pad And Its Reliability
2.
Fundamental study of underfill void formation in flip chip assembly
3.
Underfill process development for lead free flip chip assembly
4.
In-process stress analysis of flip chip assembly and reliability assessment during environmental and power cycling tests
5.
An experimental approach to develop process windows for lead-free flip chip assembly from a yield and reliability perspective
6.
Flip chip assembly in air from manufacturing and reliability perspectives
7.
New process development for flip chip assembly
8.
OSP (Organic Surface Protectant) evaluation for flip chip assembly and finite element correlation of failure mechanism
9.
Longitudinal thermosonic bonding for flip-chip assembly
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