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Keyword [Flip chip solder bump]
Result: 1 - 4 | Page: 1 of 1
1.
Study On The Simulation Of Interconnects In Microwave Multi-Chip Module
2.
Improved Yield Flip-chip Solder Bump
3.
Research On Thermomigration In The Interconnection Solder Joints In High Density Electronic Packaging
4.
Analysis Of The Effect Under Different Solder Bump Arrangement On Underfill Flow In Flip-chip Packaging
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