Keyword [Intermetallic Compound (IMC)] Result: 1 - 7 | Page: 1 of 1 1.  Investigation Of Electromigration On Lead-Free Solder Bump In Flip Chip Packaging 2.  Evaluation Of Bondability And Reliability Of Single Crystal Copper Wire Bonding In Semiconductor Packaging 3.  Electromigration Behavior Of Ni/Sn-3.0Ag-0.5Cu/ENEPIG(OSP) Solder Joints In Flip Chip Packaging 4.  Interfacial Reaction Between Cu Substrate And Lead-free Solders Under Miniaturization Trend 5.  Properties And Behaviors Of Cu-Al Intermetallic Compounds On Copper Wire Bonding In IC Packaging 6.  Thermodynamic Simulation Of Interconnected Area Of Printed Circuit In Manufacturing Process 7.  Research On Surface Treatment Technology Of Printed Circuit Board Interconnect Pattern And Its Signal Integrity   <<First  <Prev  Next>  Last>>  Jump to

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