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Keyword [Micro-electronic package]
Result: 1 - 5 | Page: 1 of 1
1.
Development Of Thermal-Structural Coupling Analysis Automation System For Micro-Electronic Package Based On Workbench And Excel
2.
Development Of Moisture Analysis Automation System For Micro-Electronic Package Based On ANSYS Workbench
3.
Reliability Investigation Of Lead-free Micro-electronic Packaging Solder Joint Under Electromigration
4.
Multi-physics Domain Optimization Design For 28nm IC Package System
5.
Research Of Mechanical Behavior Of Crack Initiation In Micro-electronic Package EMC-Cu Interface
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