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Keyword [PBGA]
Result: 1 - 15 | Page: 1 of 1
1.
Finite Element Simulation And Life Prediction For Reliability Of Lead-free Solder In PBGA
2.
Thermal Failure Analysis And Reliability Researches Of Lead-free PBGA Package
3.
Plastic Ball Grid Array Solder Joint Reliability Assessment Under Combined Cycling And Vibration Loading Conditions
4.
Fmea And Failure Control Method Of Pbga Application In Aviation Equipment
5.
Pbga Package Thermal Reliability Analysis And Structural Optimization
6.
Plastic Ball Grid Array Package (pbga) Mechanical Properties Under Different Loading Conditions And Optimization Analysis
7.
Random Vibration Reliability Analysis And Research On Solder Joint Of PBGA Board Level Assembly
8.
Dynamic Bending Test And Simulation Of PBGA Packages
9.
Study Of Thermal-hygroscopic Mechanical Properties For PBGA Electronic Package Polymer And Its Packaging Reliability
10.
Study On Process Mechanics And Thermal Reliability Of PBGA Packages
11.
Research On The Indentation Strain Rate Sensitivity Of Lead-free Solders And Thermal Fatigue Reliability Of PBGA Solder Joint
12.
Investigation Of Moisture Absorption And Baking Bahaviors Of PBGA And PQFP Plastic Packages
13.
Simulation Investigation On Solder Joint Reliability Under Vibration Or Thermal Cycling For PBGA Package
14.
Solder joint reliability of plastic ball grid array (PBGA) and bottom-leaded plastic (BLP) assemblies
15.
Study On Thermal-Mechanical Performance Of PBGA Package Devices Based On Multi-physical Coupling Method
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