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Keyword [Solder bump]
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1. Study On The Simulation Of Interconnects In Microwave Multi-Chip Module
2. Study Of Electromigration Reliability Of Solder Bump Joints
3. Investigation Of Electromigration On Lead-Free Solder Bump In Flip Chip Packaging
4. Electromigration Behavior Of Ni/Sn-3.0Ag-0.5Cu/ENEPIG(OSP) Solder Joints In Flip Chip Packaging
5. Improved Yield Flip-chip Solder Bump
6. Research On Thermomigration In The Interconnection Solder Joints In High Density Electronic Packaging
7. Analysis Of The Effect Under Different Solder Bump Arrangement On Underfill Flow In Flip-chip Packaging
8. Microstructure Of Lead-free And Tin-lead Mixed Solder Bump Research
9. Research On The Reliability Of Electromigration In Solder Bump Of Flip Chip Packaging Under Multi-physics Coupling
10. Study Of The Capillary Pressure Of Flip-Chip Underfill With Hexagonal Solder Bump Arrangement
11. Uniform Metal Droplet Controllable Printing Technology For Bump Array Used In Electronic Packaging
12. Super-Resolution Reconstruction Technique And Its Application In Defect Inspection Of Flip Chip
13. Reliability study and technology development of solder-bumped flip chip on low-cost substrate
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