Solder joint reliability - Globe Thesis

Keyword [Solder joint reliability] Result: 1 - 20 \| Page: 1 of 1
1.	Flip-chip And Related Issues
2.	Plastic Ball Grid Array Solder Joint Reliability Assessment Under Combined Cycling And Vibration Loading Conditions
3.	The Modeling And Simulation For Solder Joint Reliability Of Microelectronic IC Package By Substructure Method
4.	The Modeling And Simulation For Solder Joint Reliability Of Microelectronic Ic Package By Substructure Method
5.	Ic Chip Package Thermal - Structural Numerical Simulation Analysis And Design Optimization
6.	Thermal Analysis And Solder Joint Reliability Analysis Of Three-dimensional Stacked Csp / Bga Package
7.	Lead-free Solder Joint Reliability Under Thermal Load Electrical Measuring Methods Research
8.	Board-level Package Bonding Materials Impact On Solder Joint Reliability Of Ctbga Components
9.	Shear Tension Of Lead-free Solder Joints Creep Resistance Strain Relations
10.	Research On Reliability Of Board Level Package-on-package In Drop Impact
11.	Research On The Mechanical Properties Of Intermeallic Compound And Analysis Of Solder Joint Reliability In Electronic Packaging
12.	Simulation Investigation On Solder Joint Reliability Under Vibration Or Thermal Cycling For PBGA Package
13.	Simulation Analysis For The Influence Of Pin Size Of QFP Device On Solder Joint Reliability
14.	Performance Analysis And Application Research Of High Reliability Fiber Bragg Grating Sensor
15.	Evaluation of physical factors influencing solder-joint reliability of a 10mm leadless QFN package with top-side paddle
16.	Prognostics of solder joint reliability under vibration loading using physics of failure approach
17.	Investigation and prediction of solder joint reliability for ceramic area array packages under thermal cycling, power cycling, and vibration environments
18.	Solder joint reliability of plastic ball grid array (PBGA) and bottom-leaded plastic (BLP) assemblies
19.	Phase-field Method Study Of Micro Solder Joint Reliability Uder Thermo-mechano-electrical Coupling
20.	Study On Interface Reaction And Reliability Of SAC/Co-P BGA Solder Joints Under Rapid Thermal Fatigue
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