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Keyword [Thermosonic]
Result: 1 - 16 | Page: 1 of 1
1.
Studies On Vibration Propagation And Performance Formation Of Thermosonic Flip Chip Bonding Interface
2.
On-Line Measurement Of Cu Fab Deformability In Thermosonic Wire Bonding And Interfacial Reaction Study Of Cu/Al
3.
Research On Thermosonic Bonding Mechanism Based On Interfacial Deformation And Microcontact
4.
Thermosonic Flip-bonding Bench Visual Positioning System Design And Research
5.
Thermosonic Flip Process Heat - Stress Modeling And Multi-parameter Simulation
6.
Hot-stage Temperature Imaging And Alignment Accuracy Of The Bonding Process
7.
Principal Component Analysis Transducer System And The Bonding Point Of The Interaction Law
8.
Numerical Studies On The Stress Condition In Silicon Substrate During Copper Thermosonic Wire Bonding
9.
The Design And Experiment Research Of Wire Clamp Used In Wire Bonder
10.
Modeling And Simulation Of Wire Bonding Looping Process Based On Variable-length Link-spring Model
11.
Research For The Effect Of Ultrasonic Power And Bonding Force On Gold Thermosonic Bonding Quality
12.
Study On Ultrafine Wire Bonding Technology And Performance Of Radio Frequency Devices
13.
Research On Gold Bump Thermosonic Flip-chip Bonding Quality Control
14.
Technology and compression modeling for thermosonic flip-chip bonding
15.
Longitudinal thermosonic bonding for flip-chip assembly
16.
Experimental and modeling studies for thermosonic flip chip bonding
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