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Keyword [Underfill]
Result: 1 - 20 | Page: 1 of 2
1.
Thermal-Mechanical And Hygroscopic Characteristics Of Micro-electronic Packaging Polymer And Its Packaging Reliability Study
2.
Flip-chip And Related Issues
3.
Evaluation Of Several Underfill Materials For Chip Scale Package
4.
Viscoelastic Fracture Research Of Flip Chip
5.
Temperature Cycling Reliability Of Plastic Packages Ball Grid Array Study
6.
Research On Stress Monitoring Technology In Flip Chip Package
7.
Macroscale/mesoscale Modeling And Simulation Of Underfill Process
8.
Analysis Of The Effect Under Different Solder Bump Arrangement On Underfill Flow In Flip-chip Packaging
9.
Research Of Simulation Methods For Capillary-driven Underfill
10.
The Reserch Of Flip-chip Bonding Technology About Hybridfocal Plane Array Detector
11.
Experimental Study On Underfill Flow And Verification Of Two-dimensional Numerical Analysis Method
12.
Research On Underfill Packaging Process Of Flip-Chip Base On Surface Energy Theory
13.
Study Of The Capillary Pressure Of Flip-Chip Underfill With Hexagonal Solder Bump Arrangement
14.
Fundamental study of underfill void formation in flip chip assembly
15.
Study on the nanocomposite underfill for flip-chip application
16.
Analysis and modeling of underfill flow driven by capillary action in flip-chip packaging
17.
Thermal and moisture induced failure analysis in the microelectronics packaging
18.
Underfill process development for lead free flip chip assembly
19.
Study on the curing process of no-flow and wafer level underfill for flip-chip applications
20.
Underfill adhesion characteristics, residual stresses and analysis of thermal stresses in flip-chip packages
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