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Keyword [intermetallic compounds(IMC)]
Result: 1 - 3 | Page: 1 of 1
1.
Investigation On The Relationship Between The Microstructure Evolution Of The Intermetallic Compounds In Solder Joints And The Micro-and Macro-mechanical Behavior
2.
The Creep Behaviors Of Lead-free Micro-solder Joints And The Growth Mechanism Of Tin Whisker On Coatings In Electronic Packaging
3.
Effects Of Nano-CeO
2
Addition On Interfacial IMC Growth Of Sn-0.3Ag-0.7Cu-xCeO
2
/Cu Solder Joints
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