Flip-chip - Globe Thesis

Keyword [Flip-chip] Result: 21 - 40 \| Page: 2 of 9
21.	Investigation On Viscoelastic Characteristics Of Micro-Electronic Flip-Chip Packages
22.	Viscoelastic Fracture Research Of Flip Chip
23.	Electromigration Behavior Of Ni/Sn-3.0Ag-0.5Cu/ENEPIG(OSP) Solder Joints In Flip Chip Packaging
24.	Thermosonic Flip-bonding Bench Visual Positioning System Design And Research
25.	Thermosonic Flip Process Heat - Stress Modeling And Multi-parameter Simulation
26.	Low Cost Flip Chip Packaging Strategy
27.	Improved Yield Flip-chip Solder Bump
28.	Microwave Multi-chip Components Of Micro-assembly Of Key Technologies And Applied Research
29.	Hot-stage Temperature Imaging And Alignment Accuracy Of The Bonding Process
30.	Research On Packaging Technology Innovation Of Mobile Device Processing Chip Based On Copper Clad Laminated Flip Chip Technology
31.	Research On Stress Monitoring Technology In Flip Chip Package
32.	Study On Defect Inspection Of Flip Chip Based On Ultrasonic Excitation
33.	The Research On Defect Inspection Of Flip Chip Using Active Thermograph And Ultrasonic Inspection
34.	Failure Mechanism And Reliability Analysis Of Cu Interconnect Structures Under Thermal Stress
35.	Moisture Control Solution For LF&HF FCBGA&Thermal Applications Of Nanocrystalline Diamond Film
36.	Research On Thermomigration In The Interconnection Solder Joints In High Density Electronic Packaging
37.	The Interfacial Reaction Of Solder Joint For Flip Chip Assembly With Cu/OSP Pad And Its Reliability
38.	Research On Key Technology For Flip Chip Fault Diagnosis Using Ultrasonic Excitation And Vibration Analysis
39.	The Study Of Excimer Laser Lift-Off For Ultraviolet Light-Emitting Diodes
40.	Analysis Of The Effect Under Different Solder Bump Arrangement On Underfill Flow In Flip-chip Packaging
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