Study On Adhesive And Gluing Technology For High Moisture Content Wood

The synthetic technology of moisture curing isocyanate adhesive and adhesive technology .bonding mechanism for high moisture content wood were studied in this paper. The moisture-curing isocyanate adhesion produced in the research has been applied on wood manufacture industry. It not only achieved bonding high moistue content wood(20% ~ 150%), but also resolved the environmental pollution problem of free formaldehyde and free hydroxybenzene caused by UF and PF resin adhesive used presently. It is very important practicality value for using high quality juvenile wood and fast-growing wood to manufacturete integration slicing.Based on the systematical deep studies on adhesive formula design, materials selection, preparation process and technology control etc. the best formula and synthetic technology of moisture-curing isocyanate adhesion were confirmed, In addition, the preparation process of one-component solvent-free moisture-curing isocyanate adhesive pointing on solvent problem were also studied in this paper.Based on wooden materials with high moisture content as raw materials, the technology of man-made sliced with moisture-curable isocyanate adhesive and defined the best bonding technology were studied in this paper. Pointed on the problems of brittleness and higher cost of moisture curing isocyanate adhesive in practice, the improvement of it was done in the research.On discussion of high moisture content wood gluing mechanism: by means of contact angle and spectral microscope (combined slice of glue layer), of moisture curing isocyanate adhesive the wettablility and penetrability situation on wood surfaces with different moisture content was studied; the comparison experiment was done for different adhesive with the same moisture content; productions structure after curing reaction were studied between the moisture-curing isocyanate adhesive and high moisture content wood by FTIR, the water effect was defined on the reaction by DSC, the different points of view on mechanic combination theory, adhesive theory and chemical bond, the bonding mechanism of high moisture content wood was analyzed and explained.