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Research On Machined Technology And Machined Quality Of Endless Electroplated Diamond Wire Saw

Posted on:2007-08-29Degree:DoctorType:Dissertation
Country:ChinaCandidate:J F MengFull Text:PDF
GTID:1101360212970737Subject:Mechanical Manufacturing and Automation
Abstract/Summary:PDF Full Text Request
With the increasingly development of semiconductor industry, single crystal silicon, SiC crystal have been applied to this domain extensively. For the decreasing of machining cost, the dimension of chip increases continuously. Slicing is an important process in the manufacture of chip. In order to solve some technical problems in the slicing of big dimension crystal and harder and more difficult-to-machine materials, for example, SiC crystal, a new cutting technology of using endless electroplated diamond wire saw (EEDWS) was reported in this paper. The technology has the advantages of thin kerf, increased cutting speed, good quality, elimination of hazardous waste slurry and ability to machine harder brittle and bigger dimension materials. Through the systematical experimental research and theoretical analyses on EEDWS, the relationship between cutting parameters and cutting quality was revealed, and the measure of gaining good cutting quality was given. So the scientific basis and technological support for the precise and high effective slicing of hard brittle materials are provided.The EEDWS cutting test machine was designed and manufactured. The driving wheel was driven by a electric spindle, and the cutting speed was controlled by converter governor. Working table was mounted on high precision sliding guide, and was fed by a feed load. The machine is simple in construction, easy to control, and reliable on machining.Through the cutting experiment of single crystal silicon and LT55 ceramics, the influence of cutting speed, feed force and material properties on the cutting efficiency, cutting force, surface roughness, damage thickness and saw wear was researched. In order to improve cutting efficiency and quality, the cutting parameters were optimized by orthogonal tests.According to the analyses of vibration and strength of the saw, the cutting parameters were optimized. The vibration equation of wire saw cutting was built up. And the random vibration of wire saw was studied firstly, so the influence of cutting speed and tension on vibration was investigated. Depending on the strength of the wire saw, the maximum tension and feed force of wire saw was given. When the cutting speed is less than a given value, higher cutting speed has little influence on the vibration. So the high cutting speed of EEDWS does not increase the vibration. If the tension is higher, the vibration decreases. But when tension increases to a given value, higher tension does not have influence on vibration almost. For the wire saw using in...
Keywords/Search Tags:endless electroplated diamond wire saw, single crystal silicon, LT55 ceramics, machined quality
PDF Full Text Request
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