The Study On Heat-Conduction And Bending Performance In Low Temperature Of Plywood

In this paper, heat-conduction during the process of hot pressing and in low temperature of plywood were tested and analyzed; the bending performance of plywood in low temperature was researched. The results showed:(1)The curves of temperature changing of mat central layer during the process of hot pressing were obviously divided into four stages. Adhesive types, resin content, wood species and fibred form affected heat-conduction during the process of hot pressing indistinctively. Thickness of panel, moisture content of veneer and the original temperature of mat impacted heat-conduction greatly.(2)The curves of temperature changing of mat central layer during the process of refrigeration by low temperature were divided into two stages. The curves of temperature changing of mat central layer during the process of calefaction by low temperature were divided into three stages. Adhesive types, resin content, wood species and fibred form affected heat-conduction in low temperature indistinctively. Thickness of panel, moisture content of veneer and density of mat impacted heat-conduction in low temperature greatly.(3)The heat-conduction of plywood during the process of hot pressing and in low temperature could be simulated by Malthus model, Liner Function and Power Function.( 4) Bending performance of plywood descended after treated with low temperature. Bending performance of plywood was enhanced by low temperature. Moisture content of plywood impacted bending performance in low temperature greatly. The relativity of MOR and MOE was remarkable. The MOR values of plywood could be doped out by 2-Polnomial Function.(5)To analyze statistically the bending performance of plywood in different states, the MOR∥,MOR⊥,MOE∥and MOE⊥of plywood were researched Statistically in this paper. The results showed that the bending performance of plywood was in line with Normal distribution and Weibull distribution.