Polymer Material Surface Metal Of The New Method

A novel method of surface metallization for polymers-reduction method was found recently. The study is in the early stage for it is newly discovered. In this paper, the new surface metallization method is studied in detail.According its principles for preparing surface metallized polymer, the kinds of polymers, metal salts and reducing agent were chosen. The surface metallized films of polyvinyl alcohol (PVA) and polyacrylonitrile (PAN) containing metal salt were researched systematically. On the above mentioned base, the metallized films of polyvinyl formal (PVF), polyvinyl butyral and polyethersulphone prepared by reduction were newly developed. The conditions of preparing aforesaid metallized films and the effects of conductivity were discussed thoroughly. Under specific conditions, the conductivity of polymer metallized film prepared by reduction in NaBH₄ aqueoussolution is very good, and the major characterization is higher than that of the same research in abroad.The properties of polymer/metal salt chelate films before and after reduction were studied by means of different analyzing and testing methods. The formation of polymer-metal salt complex was proved by IR and UV analysis. The reduction efficiency shows that more than 60.0% of metal contains was reduced to the surface layer of the metallized film. Combined with the results of SEM and electron probe analysis, it is found that the ion migration from the inside to the surface of the film exists when preparing polymer metallized film by reduction. The different effects of the ion migration was also researched. Compared with that of conductive polymers, into which the conductive materials are kneaded, the mechanic properties are less effected by the amount of metal salt. The attaching strength between the metal layer and polymer is perfect according to the test of the metallized film prepared in this work. Magnetic properties of polymer metallized films containing Co and Ni were also found. The application of metallization method by reduction were explored. The technology of metallizing the holes in the single and double-side printed wiring board and metallizing some non-conductive materials by reduction method was developed for the first time.In this paper, the mechanism of surface metallization by reduction method is proposed for the first time. It expounds the metallizing process from two aspects. One is the driving force for the ion migration, the other is the possibility for ions migrating in the polymer film. On the basis of the work, the further research on it would be done more smoothly.