New Phenylethynyl Terminated Benzimidazole-based Polyimide Matrix Resin And Carbon Fiber Reinforced Composites

Polyimide (PI) films have been widely applied in high technology fields, due tothe good combination of properties, including thermal resistance, mechanicalproperties, dimensional stability and electric insulating properties. The most classicalapplication is the flexible substrate materials. For example, PI films could be used asthe substrates of the flexible printed circuit board (FPC) and tape automated bondingin the field of microelectronics; they also could be the flexible substrates of thin-filmssolar cells. High performance of PI films is required for these applications. Forinstance, when used as the substrates for FPC, Besides, CTE values should be smallerfor the application of solar cells. Common PI films have CTE values of greater than30ppm/K. Therefore, properties of PI films are required to improve to adapt to theneeds of high performance applications.This paper uses a benzimidazole group containing diamine monomer2-(3-amino-phenyl)-5-aminobenzimidazole and dianhydride monomer polycondensationreaction to obtain a series of polyimide film, and thermal and mechanical properties ofsuch films were characterized. The results show that the film has such high heatresistance and good mechanical properties. Meanwhile, the relative position of theamino group to give diamines of the molecular chain with high bending resistance,such that the thermoplastic polyimide has a better thermal expansion coefficient andhigher. Using i-DAPBI and DAPBI as diamine monomer, using phenylacetyleneanhydride (4-PEPA) capped directly synthesized small molecule model compounds.While using different types of i-DAPBI dianhydride monomer (s-BPDA, a-BPDA,ODPA, BPADA) copolymer, prepared after the process temperature of thethermoplastic polyimide; another part uses the same4-PEPA capped give differentdegrees of polymerization polyimide prepolymer by melt-pressed and crosslinked at 370℃1hour to obtain a polyimide film thermoset polymer and a comparison of theperformance. Studies show that this synthesized polyimide resin has reached theinternational advanced level, is a good can be applied to an advanced aerospace resinmatrix. Especially the use of a resin prepared by i-DAPBI lower melt viscosity andhas a wide processing window; simultaneously cured with better thermal stability,with a very good potential applications. After the evaluation of the resin, use of a resinprepared in which the carbon fiber reinforced composite materials, compositematerials were preliminary evaluation test results show that the composites haveexcellent mechanical properties, and more excellent performance in the future for thepreparation of poly imide carbon fiber composite material made improvements.