| Information and electronic industries relates to national interests and security, advanced electronics manufacturing industry is the cornerstone of the development of information and electronic industry, the development of advanced electronics manufacturing industry depends on advanced technology and equipment, but the reality is that high-performance chip packageequipments in China are imported from abroad, including the technology of visual positioning system unit, there are no independently developed the ability, even the area array chip package device is blank. Therefore, To develop their own copyright and to adapt to the process requirements of the next generation after the closure of key production equipment, not only is the need for strategic development of China’s electronic manufacturing industry, also meets China’s national economic health and sustainable development of the urgent needs. This paper presents a BGA device auxiliary positioning systems, and studies systematly on the visual positioning technology which includes architecture, hardware design, software algorithms and other aspects of the system.f a single packageform, which is a big step forward for the IC packaging.But he surface array chip packaging equipment also puts forward higher requirements and visual positioning technology is a key technology in the packaging equipment unit.In this paper, architecture, hardware design, software algorithms and other aspects which involve the visual positioning technology are being studied.The paper presents the architecture of a visual positioning system, analysis of the various functional modules in the system, and studies mechanical hardware characteristics and the selection of the principles, puts forward complementary color light source based on LED lighting,provides sufficient free imageshadow lighting for the image with weakening the influence of ambient light.Then focusing on the study of the visual positioning system of the optical system, it proposes a method based on single-camera, dual-target imaging by the study of dual-camera imaging and dynamic camera France.In the visual positioning system, the most critical technology is the contour extraction of chip pin image. In this thesis, by contrast to the traditional operator, morphological, wavelet theory and so on, it proposes edge detection algorithm based on fractal theory. Generally, traditional edge detection methods are mostly based on the original image.Edge detection uses the edge near the first or second derivative direction variation so it is extremely sensitive to noise and it often causes the edge of false detection.This image processing is extremely unfavorable, this paper Proposed fractal-based algorithm for image edge detection method. When the statistical properties of the image surface to meet the isotropic DFBR field, we can strike a fractal parameter H to determine the value of the edge, to meet DFBR field model for the image region0<H<1, if H>1means that the fractal dimension of small its topological dimension, destroyed DFBR field consistency, no longer meet the conditions of isotropy, the reason lies in the edge region. Starting from the H parameter in this paper, detect the edge image, and make further improvements in the algorithm and propose compatibilizer matrix,which overcomes the less sensitive to noise, misses the true edge without the introduction of false edges, improves operation speed and with the good effect and strong anti-jamming.In this thesis, it designs and develops a BGA visual automatic positioning system. In positioning system, image and spectroscopic calibration directly determine image positioning accuracy. Through the location of the PCB, prism and chip calibration,it ensures the BGA chip and the PCB solder joint image match with the same size.By analyzing the characteristics of the area array chip, this paperproposes the localization algorithm based on point pattern matching, which is simple, high positioning accuracy and speed.With the point pattern matching algorithm,it calculates the displacement deviation of X, Y,θ direction, by fine-tuning of the servo motor-driven suction institutions to achieve automatic alignment of the BGA chip and the substrate. Applied to the social production of reality, it can achieve significant direct economic benefits and at the same time, the production of product units, R&D costs will greatly reduce, which improves production efficiency and has great social benefits. |