Preparation And Thermal-conduction Property Of Epoxy Resin/Ceramic-hybrids

As modern electronic devices continue to develop toward faster,higher integration,miniaturization,and higher performance,one of the most vital challenges is how to efficiently remove redundant heat generated by high-power integrated circuits.Polymer materials with high thermal conductivity has become a necessity for the performance and reliability in next generation electronics devices.Polymer materials used as the packaging materials for electronics play a key role in heat dissipation.Therefore,the development of polymer materials with high thermal conductivity is of great technological importance.Therefore,more and more people are committed to high heat dissipation capability package materials.In this study,our interest to enhance the thermal conductivity of composites is focused on three different hybrids: Boron nitride@graphene oxide,Boron nitride-reduced graphene oxide and Aluminum nitride-nanoparticles.Firstly,the h-BN particles were treated with silane coupling agent to generate amine groups on their faces.Owing to the positive charge of GO and negative charge of h-BN,electrostatic interaction between GO and h-BN occurred which formed h-BN@GO hybrids.The interface and internal structure of the hybrids were characterized by TEM,SEM,XRD,FTIR and TGA.Then the thermal conductivity of h-BN@GO/Epoxy was investigated.The results showed that the thermal conductivity increased with an increase in filler loading.The thermal conductivity of h-BN@GO/Epoxy is double and ten times higher than that of h-BN/Epoxy and pure Epoxy.The thermal conductivity of h-BN@GO/Epoxy reached 2.23 Wm-1K-1 at a loading of 40 wt%.The experimental results of thermal expansion coefficient showed the composite has outstanding thermal mechanical stability.We simulated the thermal conductivity with Foygel model and calculated the interfacial thermal resistance.Secondly,the boron nitride@graphene oxide hybrids were reduced to boron nitride-reduced graphene oxide hybrids.The interface and internal structure of the hybrids were characterized by TEM,EELS,AFM,XRD,FTIR and Raman.The thermal conductivity of h-BN-RGO increased with the fraction of the fillers consistently.The composite containing 26.04 vol% h-BN-RGO exhibits the highest thermal conductivity(3.45 Wm-1K-1),which is 15 times higher than that of epoxy.We used Maxwell-Garnett effective medium approximation to analyze our experimental results,which fitted the experimental values of thermal conductivity.We investigated the energy storage characteristics and the results indicated that as the filler increased the breakdown strength decreased.Meanwhile both the leakage current and the charged energy density increased as well.Finally,we use a novel nanoparticle which is composed of silver nanoparticle deposited aluminum nitride as filler for epoxy to investigate the thermal conductivity.The experimental results demonstrated that the AgNPs can make a bridge between adjacent nanofillers which formed an effective thermal conducting networks.Moreover,the composites containing AlN-AgNPs exhibited higher thermal conductivity than those containing AlN nanoparticles and pure epoxy.When the volume fraction reaches up to 19.54 vol%,the thermal conductivity of AlN-AgNPs/epoxy composite reaches 3.66 Wm-1K-1,which is 16 times higher than that of epoxy.It was founded out that the percolation phenomenon in the composites after we simulated the experimental results with Foygel model.Furthermore,we examined the energy storage characteristics of the composites and the results indicated that it is not a kind of energy storage material though the energy efficiency is high.