Feasibilty of a Multi-bit Cell Perpendicular Magnetic Tunnel Junction Device

The ultimate objective of this research project was to explore the feasibility of making a multi-bit cell perpendicular magnetic tunnel junction (PMTJ) device to increase the storage density of spin-transfer-torque random access memory (STT-RAM). As a first step toward demonstrating a multi-bit cell device, this dissertation contributed a systematic and detailed study of developing a single cell PMTJ device using L10 FePt films.;In the beginning of this research, 13 up-and-coming non-volatile memory (NVM) technologies were investigated and evaluated to see whether one of them might outperform NAND flash memories and even HDDs on a cost-per-TB basis in 2020. This evaluation showed that STT-RAM appears to potentially offer superior power efficiency, among other advantages. It is predicted that STTRAM's density could make it a promising candidate for replacing NAND flash memories and possibly HDDs if STTRAM could be improved to store multiple bits per cell.;Ta/Mg0 under-layers were used first in order to develop (001) L1 0 ordering of FePt at a low temperature of below 400 °C. It was found that the tradeoff between surface roughness and (001) L10 ordering of FePt makes it difficult to achieve low surface roughness and good perpendicular magnetic properties simultaneously when Ta/Mg0 under-layers are used. It was, therefore, decided to investigate MgO/CrRu under-layers to simultaneously achieve smooth films with good ordering below 400°C. A well ordered 4 nm L10 FePt film with RMS surface roughness close to 0.4 nm, perpendicular coercivity of about 5 kOe, and perpendicular squareness near 1 was obtained at a deposition temperature of 390 °C on a thermally oxidized Si substrate when MgO/CrRu under-layers are used.;A PMTJ device was developed by depositing a thin MgO tunnel barrier layer and a top L10 FePt film and then being postannealed at 450 °C for 30 minutes. It was found that the sputtering power needs to be minimized during the thin MgO tunnel barrier deposition because the high sputtering power can degrade perpendicular magnetic anisotropy of the bottom L1 0 FePt film and also increase RMS film surface roughness of the MgO tunnel barrier layer.;From a lithographically unpatterned PMTJ sample, MR ratio and RA were measured at room temperature by the CIPT method and found to be 138% and 6.4 kOmicrom2, respectively. A completed PMTJ test pattern with a junction size of 80x40 microm2 was fabricated and showed a measured MR ratio and RA product of 108% and 4~6 kOmicrom 2, respectively. These values agree relatively well with the corresponding values of 138% and 6.4 kOmicrom2 obtained from the unpatterned PMTJ sample measured by a current-in-plane tunneling (CIPT) method.