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Modeling of package and board power distribution networks using transmission matrix and macro-modeling methods

Posted on:2003-01-24Degree:Ph.DType:Dissertation
University:Georgia Institute of TechnologyCandidate:Kim, Joong-HoFull Text:PDF
GTID:1462390011481212Subject:Engineering
Abstract/Summary:
An important area in high-speed digital systems is the design of the power/ground planes arising in power distribution networks. Realistic power distribution networks in the package and board are electrically large structures containing numerous discontinuities and components. As a result, there has been a clear need for more efficient modeling methods to accurately model such large networks. In this dissertation, two methods have been discussed for frequency and transient simulations. Using the property that power distribution networks in the package and board can be represented as a cascade of unit cells consisting of distributed and repeated RLCG circuit elements, the multi-input/multi-output transmission matrix method can be used to simulate arbitrarily shaped, electrically large structures efficiently. For analyzing I/O switching noise, power distribution networks need to be analyzed in the presence of interconnects and non-linear drivers. For such system level simulation, the need for improved circuit analysis is required. In this dissertation, two macro-models have been developed; namely, a Y-parameter based macro-model using a weighted least squares approximation by solving an eigenvalue problem and a Z-parameter based macro-model using direct mapping.
Keywords/Search Tags:Power distribution networks, Package and board, Transmission matrix, Macro-model using, Methods, Electrically large structures
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