Molecular tailoring of interfaces for thin film on substrate systems

Thin film on substrate systems appear most prevalently within the microelectronics industry, which demands that devices operate in smaller and smaller packages with greater reliability. The reliability of these multilayer film systems is strongly influenced by the adhesion of each of the bimaterial interfaces. During use, microelectronic components undergo thermo-mechanical cycling, which induces interfacial delaminations leading to failure of the overall device. The ability to tailor interfacial properties at the molecular level provides a mechanism to improve thin film adhesion, reliability and performance. This dissertation presents the investigation of molecular level control of interface properties in three thin film-substrate systems: photodefinable polyimide films on passivated silicon substrates, self-assembled monolayers at the interface of Au films and dielectric substrates, and mechanochemically active materials on rigid substrates. For all three materials systems, the effect of interfacial modifications on adhesion is assessed using a laser-spallation technique. Laser-induced stress waves are chosen because they dynamically load the thin film interface in a precise, noncontacting manner at high strain rates and are suitable for both weak and strong interfaces.;Photodefinable polyimide films are used as dielectrics in flip chip integrated circuit packages to reduce the stress between silicon passivation layers and mold compound. The influence of processing parameters on adhesion is examined for photodefinable polyimide films on silicon (Si) substrates with three different passivation layers: silicon nitride (SiNx), silicon oxynitride (SiOxNy), and the native silicon oxide (SiO2). Interfacial strength increases when films are processed with an exposure step as well as a longer cure cycle. Additionally, the interfacial fracture energy is assessed using a dynamic delamination protocol. The high toughness of this interface (ca. 100 J/m2) makes it difficult to use more conventional interfacial fracture testing techniques.;Self-assembled monolayers (SAMs) provide an enabling platform for molecular tailoring of the chemical and physical properties of an interface in an on-demand fashion. The SAM end-group functionality is systematically varied and the corresponding effect on interfacial adhesion between a transfer printed gold (Au) film and a fused silica substrate is measured. SAMs with four different end groups are investigated: methyl, amine, bromine and thiol. In addition to these four end groups, mixed monolayers of increasing molar ratio of thiol to methyl SAMs in solution are investigated. There is a strong dependence of interfacial chemistry on the adhesion strength of Au films. In addition to the chemical functionality of the SAM, surface roughness of the underlying substrate also has a significant impact on the interfacial strength.;Thin films of mechanochemically active polymer are subjected to laser-generated, high amplitude acoustic pulses. Stress wave propagation through the film produces large amplitude stresses (>100 MPa) in short time frames (10-20 ns), leading to very high strain-rates (ca. 107-108 s -1). The polymer system, spiropyran (SP)- linked polystyrene (PS), undergoes a force-induced chemical reaction causing fluorescence and color change. Activation of SP is evident via a fluorescence signal in thin films subject to high strain-rates. In contrast, quasi-static loading of bulk SP-linked PS samples failed to result in SP activation. Mechanoresponsive coatings have potential to indicate deformation under shockwave loading conditions.;In addition to SP-linked polymer films, the activation of spiropyran interfacial molecules with different side groups is characterized as they adsorb onto a SAM platform with preferential amine terminating chemistry. The reactivity of SP monolayers due to UV irradiation is evaluated by water contact angle goniometry and fluorescence spectroscopy. Side groups on the interfacial spiropyran molecule affect the reactivity and the proximity of neighboring spiropyrans can prevent efficient mobility.