Research And Development Of New High-purity Microelectronic Packaging Materials

Microelectronic packaging technology and materials are one of the most important factors that restrict the design, application and development of microelectronic technology. Entering the twenty-first century, microelectronic technology and microelectronic packaging technology has been rapidly developed, but the development of microelectronic packaging materials is slow. With the progress of electronic products towards the high-integration, cabling-miniaturization, lead-free and other directions, it is directly required that microelectronic packaging materials should be high purity and high heat-resistant in the new electronic packaging.Based on that purpose, we developed a low-chlorine epoxy resin and improved its heat resistance by introducing a heat-resistant group to the epoxy monomer molecular main chain so as to meet the demands of new 3D packaging technology.At the same time, the process will be long and costly if it only relies on experiments to meet the new requirements of microelectronic packaging materials. This paper also uses a molecular simulation method to study the performance of the epoxy resin cross-linking system.A new process of preparing low-chlorine o-cresol novolac epoxy resin was introduced. O-cresol novolac resin was synthesized in the presence of a special mixed catalyst (oxalic acid and another co-catalyst). Then, the resultant resin was further reacted with epichlorohydrin (ECH) to prepare o-cresol novolac epoxy resin (CNE). The relationship between the properties and the reaction conditions of o-cresol novolac resin and o-cresol novolac epoxy resin were also studied. O-cresol novolac epoxy resins were synthesized with certain performances through the adjustment of the reaction conditions, which were suited for the exigent demands for ultra-high purity o-cresol novolac epoxy resin.Novolac resin is an important curing agent of epoxy resins. According to the mechanism of synthesizing o-cresol novolac resin, a research on the controlled synthesis of different proportion of ortho-substituted ortho-cresol novolac resins under different reaction conditions was studied. Then, the chemical structures of different ortho-substituted ortho-cresol novolac resins were investigated, and the curing kinetics study of curing ortho-cresol novolac epoxy resin was also addressed, which was proved that the autocatalysis effect was also available for curing epoxy resins.The most used method to develop the heat-resistance of epoxy resin is modifying epoxy resin with heat-resistant monomer. According to the mechanism of synthesizing o-cresol novolac resin, an allyl modified o-cresol novolac resin was prepared by o-cresol novolac resin and allyl chloride, which was a new curing agent with two different reactive groups. It was used for co-curing o-cresol novolac epoxy resin and BMI in order to introduce imide into epoxy molecular chain. The purpose of this research was to obtain high heat-resistant effect.Molecular simulation method is a useful, scientific method which is between experiment and theory researches. Based on the molecular model of multifunctional epoxy resin and its crosslinking system, a molecular simulation method was developed. The method could obtain a model closer to the actual epoxy crosslinking system. Based on the method, some performances of o-cresol novolac epoxy resin crosslinking system could be calculated, which was closer to the actual system.