Research On Key Technologies Of Low-Void-Rate Double-Sided Laminated Packaging Based On Semiconductor Lasers

In this paper,the technology and structure of single-emitter semiconductor laser chip packaging are optimized and designed for semiconductor laser packaging technology,including die-bonding technology,vacuum reflow soldering technology,optimization of Submount structure and design of new heat sink structure,starting from the design optimization of the basic structure of the Submount,thermal management and the setting of key parameters of vacuum reflow welding to reduce the void rate of the device and To improve the photoelectric conversion efficiency,stability and reliability of the device,and to carry out in-depth study of the relevant mechanism,and to attack the key problems through extensive experimental verification.First,a method of differential detection analysis is proposed for the die-bonding technology of semiconductor laser packages.By establishing a 3D physical model,we use software of Zemax and Ansys Workbench to carry out a theoretical analysis of the "underhang" and "overhang" effects in the die-bonding process.The theoretical analysis of the tracing and thermal characteristics was conducted using Zemax and Ansys Workbench to improve the error tolerance of the die-bonding technology by 3 μm,analyze the relationship between the thermal dispersion angle and the device,optimize the design of the submount structure,and effectively improve the reliability of the device.The Matlab-based beam shaping system is designed to verify the applicability and stability of the Submount structure for beam shaping by using its real-time spot detection.Next,the vacuum reflow soldering technology is studied.Through quantitative experiments to verify the reflow parameters,namely time,temperature,pressure on the reflow effect,to explore the mechanism of vacuum reflow,detailed analysis of the impact of solder,vacuum,flux and pressure on the solder voids,the escape velocity of bubbles in the reflow chamber solder,the derivation of theoretical equations to calculate the escape velocity of bubbles at different pressures,a series of theoretical analysis of the solder layer voids Study,and proposed a wavelength difference in the void rate detection method,such a method can effectively assess the device’s void rate.The final design of vacuum reflow soldering procedure,the subsequent experimental studies show that in the pretreatment zone,warming preheating zone,holding welding zone and cooling zone parameters optimization,soldering temperature of 270℃,soldering time of 100 s,pressure of 20 g,the soldering effect can reach the best state,the highest device reliability.Finally,a new DC-Mount package structure for semiconductor lasers is designed.The concept of laminated package for single-emitter semiconductor laser is proposed,and the junction temperature of different thicknesses of heat sink is compared by establishing a threedimensional physical model,analyzing and comparing with the traditional type C-Mount package structure,applying finite element analysis,optimizing the size of the new heat sink structure,and simulating and characterizing the junction temperature,temperature distribution and heat vector distribution of the device.Finally,through the device preparation,the basic performance parameters are tested,and the photoelectric conversion efficiency of the device is improved to more than 60%,and the thermal resistance is reduced by about 31%,which can effectively improve the working performance of the device.The research work in this paper provides a theoretical and practical basis for the packaging technology of semiconductor lasers,and is verified by a large number of experiments for reliability.For semiconductor lasers,it has a certain reference value for the improvement and optimization of their targeted packaging technology to enhance the photoelectric conversion efficiency,increase the operating power and reduce the junction temperature of the devices.