Research On Additive Manufacturing And TPMS Structure Of Copper Based Diamond Composites

The development of microelectronic devices in key components such as aerospace,5G base stations,and wearable equipment is moving towards miniaturization,high integration,and high-power,posing new challenges to heat transfer and thermal management.It is urgent to develop lightweight,multifunctional,precision metametallic materials and efficient thermal management devices.In recent years,the structure of triple periodic minimal surfaces(TPMS)has become a widespread concern for porous structure researchers due to its precise control of implicit functions,smooth surface,and highly connected pores.However,traditional processes for forming complex structures such as welding joints have unstable strength,and defects such as porosity and inclusions are prone to occur during the casting process,making it difficult for product quality to meet usage requirements.In order to overcome the above difficulties,this article proposes to use selective laser melting(SLM)technology to directly shape complex TPMS structures and copper-based diamond composites with excellent thermal and mechanical properties,based on the rapid formation of complex TPMS structures using SLM technology.By adjusting material composition,powder preparation,and forming process parameters,Solve the defects caused by poor powder fluidity,unstable melt pool,rapid heating and cooling during SLM forming of copper-based diamond composite materials,and achieve rapid and accurate forming of complex TPMS structured diamond/copper composite materials.The main research content is as follows.(1)Research on SLM Preparation of Titanium and Copper Coated Diamond/Copper Composite Materials.The thermal conductivity of the prepared 1 vol.% copper plated diamond/copper composite material is as high as 336 W/m K.1 vol.% and 3 vol.% copper plated diamond/copper composites have lower coefficient of thermal expansion and higher thermal conductivity,and they also have stronger bending strength than the corresponding titanium plated diamond/copper composites.The 1 vol.% copper plated diamond/copper composite sample has no cracking,and the interface between the copper matrix and diamond reinforcement is well bonded,laying a material foundation for SLM forming TPMS copper-based diamond composite materials;(2)Study on the properties of copper plated diamond/copper metamaterial with different homogeneous TPMS structures formed by SLM.Adopt SLM prepared three kinds of 1 vol.% copper plated diamond/copper metamaterial with different homogeneous TPMS structures,including G structure,P structure and D structure.From a lightweight perspective,the order of TPMS homogeneous structures with a wall thickness of 0.2 mm is P structure,G structure,and D structure.If heat transfer performance is an important consideration,a 0.2D structure can be chosen.Further research was conducted on the continuous design of TPMS homogeneous D structures with wall thicknesses of 0.4,0.6,and 0.8 mm.When the load was 200 MPa,the best choice was the 0.4D TMPS homogeneous structure because of its high heat transfer efficiency,equivalent to the 0.6D TMPS homogeneous structure.However,compared to the 0.8D and 0.6D TMPS homogeneous structures,its weight was reduced by 39.56% and 21.23%,respectively.However,when the load is above 400 MPa,a 0.8D TMPS homogeneous structure should be selected,with the highest heat transfer efficiency,compressive strength,and specific energy absorption rate among all structures;(3)Study on the mechanical and thermal properties of different TPMS gradient structures.Comparative studies were conducted on the mechanical and thermal properties of P,G,and D structures with wall thickness gradient,as well as the mechanical and thermal properties of heterogeneous gradient structures.The results show that the P structure with gradually changing wall thickness has better compressive strength than the G structure with gradually changing wall thickness,but its heat transfer efficiency is slightly inferior.If compressive strength needs to be considered,a wall thickness gradient P structure should be selected.Heterogeneous gradient PG structure is a lightweight choice,with a mass and ultimate compressive strength of 15.43 g and 31.10 MPa,respectively,and good heat transfer efficiency.When the load is 50 MPa,the heterogeneous gradient DP structure is the best choice because of its high heat transfer efficiency and lighter weight than other structures.But when the load is above 90 MPa,a wall thickness gradient D structure should be selected,which has higher ultimate compressive strength and specific energy absorption rate.This paper conducts research on the preparation of copper plated diamond/copper composite powder and SLM additive manufacturing process,achieving the formation of precise and complex TPMS structure design.Simulation and experimental methods are used to analyze the mapping relationship between homogeneous and gradient TPMS structure and performance,and to establish dual functional regulation capabilities in both thermal and mechanical aspects.This study has achieved the precision forming of complex structures in TPMS in the field of high-performance diamond copper based composite additive manufacturing,providing a new solution for thermal management of microelectronic devices.