Research On Microwave Passive Devices And RF Chips Based On Thin Film Integrated Passive Devices Technology And PCB Technology

Face the development trend of high frequency,broadband,high performance and low cost of modern wireless communication system,modern communication has entered the era of multi-standard,multi-function and ultra-miniaturization.This puts forward higher requirements for the hardware-based radio frequency(RF)front-end and RF devices in the wireless communication system.In order to solve the key problems in the current research of RF and microwave passive devices and chips,including the technical problems of multi-band coexistence interference suppression,the performance problems of single device function,low frequency and narrow bandwidth,etc.,This thesis is devoted to the two technical processes of printed circuit board(PCB)and thin film integrated passive devices(TFIPD)for different application scenarios,and deeply study the impact of this two technology on the theoretical aspects,device circuit design,chip performance improvement,etc.,and proposed a series of radio frequency single circuits and chips including device broadband,filter integration,and circuit miniaturization.The main works of this thesis are including the following two aspects:1.Research on filters based on printed circuit board(PCB)technology:(1)Using microwave network matrix theory,a wideband bandstop filter with extreme sharp skirt selectivity is designed based on the cascaded quarter-wavelength coupling line and transmission line structure,which can achieve 64%high stopband rejection bandwith and 680 dB/GHz&340 dB/GHz attenuation rate;(2)Using the coupled stopband circuit loaded with a grounded absorptive resistor,a wideband multizero absorptive bandstop filter with multi-transmission zeros is proposed with the measured stopband rejection relative bandwidth(RB)of 71.3%and the all-passband return loss(RL)better than 12 dB;(3)Introducing the co-design method of microstrip lines and capacitors,a 3.3-3.6 GHz quasi-elliptic balanced bandpass filter is effectively constructed with ultra-wide stopband rejection up to 16 GHz and all-band common-mode rejection;based on the printed circuit board(PCB)technology,this thesis proposes a series of single-ended/differential filter circuits with high suppression,wide frequency band,and low insertion loss,which can effectively suppress stray signals under strong signal interference,ensure the distortion free transmission of useful signals,and help solve the technical problems faced by face-to-face wireless communication systems,such as complex spectrum and system coexistence,and improve spectrum efficiency.2.Research on microwave passive components and chips based on thin film integrated passive devices(TFIPD)technology:(1)Using the theories and methods of lumped element inductance and capacitance(LC)circuit network and hybrid S-parameter matrix,an electromagnetic simulation model of narrowband 4.9 GHz balanced bandpass filter with high common mode suppression is designed with all-band common mode suppression up to 20 dB and the size of the chip model is smaller than 1 mm2;(2)By introducing the generalized quasi-Chebyshev lowpass matching network and combining the transmission zero LC resonant circuit,a broadband quasi-elliptic power divider circuit and chip integrating stopband suppression and impedance-transforming are designed and realized,the measured return loss and isolation are better than 15dB,the in-band insertion loss is less than 1.08 dB,and the chip circuit size is only 1.1×1.6 mm2;(3)By using T-type bandstop filter passive network loaded with series RLC resonant absorptive circuit,an ultra miniaturized and ultra-thin absorptive bandstop filter chip is realized,the measured stopband bandwidth is up to 100.6%,the input return loss of the all-band from 0 to 16 GHz is better than 14.3 dB,and the chip circuit size is only 0.82×1.06 mm2;(4)Based on lowpass and highpass series parallel LC resonant networks,an ultra-miniature diplexer chip for N78-N79 carrier aggregation application scenario is designed,it’s measured in-band insertion loss is less than 2.2 dB,out-of-band rejection is better than 24 dB,and the chip circuit size is only 1.7×1.4 mm2.The RF and microwave passive devices and chips proposed in this thesis based on thin film integrated passive device(TFIPD)technology have obvious advantages in device miniaturization,processing accuracy,performance stability and technology integration.They can be widely used in highly integrated 5 G mobile terminal equipment.The above researches have been published in the international journals including:IEEE Transactions on Microwave Theory and Techniques,IEEE Transactions on Circuits and Systems Ⅱ Express Briefs,IEEE Transactions on Plasma Science,IEEE Microwave and Wireless Components Letters,2020 IEEE/MTT-S International Microwave Symposium(IMS),etc..