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A Theoretical Model For The Interface Adhesion Of An Elastic-plastic Thin Film /substrate System By A Blister Test

Posted on:2011-07-08Degree:MasterType:Thesis
Country:ChinaCandidate:H X HaoFull Text:PDF
GTID:2121330332464021Subject:Materials Physics and Chemistry
Abstract/Summary:PDF Full Text Request
With the development of science and technology, thin films with unique characteristics and behaviors have been increasingly used in many widely varying applications. Due to the heating loads, electric loads as well as mechanical loads in the case of the film at service state, thin film may fail. Therefore, thin film failure is of great concern by scientists and engineers. In fact, interface delamination is a typical failure mode in the thin film/substrate system. Many researches show that the most significant factor influencing the life of thin film is interface adhesion properties. Accordingly, characterizing of the interface adhesion quality has been of great scientific and commercial interest. In this thesis,theoretical models on the characteristics of the interface adhesion properties of a thin film/substrate are proposed by numerical calculation method and analytical method.A blister test is a very convenient technique to measure the adhesion energy of thin films. This thesis focuses on the model about the interface adhesion energy of the thin film/substrate system using blister test. Firstly,it is the induction about the development of the interface adhesion energy and the model of blister test method. Secondly, theΠtheorem was applied to derive the form between the blister experimental data and the interface adhesion energy for an elastoplastic film/rigid substrate system. Using the form associated with finite element calculation,we obtained an empiric formula on the interface adhesion energy in good agreement with the experimental results of Pyromellitic dianhydride and oxydianiline (PMDA-ODA) film/Al subatrate. Thirdly, based on plastic flow rule and the bending theory of beams, a one-dimensional model of an assembly of tapered beams is developed to investigate the interface adhesion energy of elastoplastic film deposited on a rigid substrate by a blister test. By compare analytical results of nickel film deposited on low carbon steel substrate with finite element calculation results, we find that the above analytical model for blister test is effective. At last, an analytical solution of the interface adhesion energy under the consideration of the substrate deformation is obtained. The ranges of the interface adhesion energy are obtained. The investigation provides the foundation to estimate interface adhesion of thin film/substrate systems.
Keywords/Search Tags:Blister test, Interface adhesion energy, Thin film/substrate system, Finite element calculation
PDF Full Text Request
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