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Preparation And Properties Study Of Fast-curing Wet-bonding Adhesive

Posted on:2011-02-28Degree:MasterType:Thesis
Country:ChinaCandidate:G Q ChenFull Text:PDF
GTID:2121330338476460Subject:Organic Chemistry
Abstract/Summary:PDF Full Text Request
In order to prepare the adhesive which is suitable for using in conditions with water, the core of this paper is to study the water-absorbent filler and compounded curing agent.Water-absorbent filler could assist the adhesive to transfer the water on the bonding surface, and improve the bonding strength. CaO, MgO, and cement are commonly used in absorbent packing. In this paper, sodium polyacrylate, polyacrylamide and sodium polyacrylate-acrylamid super absorbent resin, all of which are used as water-absorbent filler in adhesive, are prepared. The analysis of the water absorption of these super absorbent resin has shown that monomer ratio, monomer concentration, neutralization degree, as well as other factors such as amount of crosslinking agent have significant impact on the water absorption of the super absorbent resin.Compounded curing agent is the key component of the fast-curing wet-bonding adhesive, and determines the basic structure and performance of the adhesive. In this paper, epoxy-m-phenylenediamine, thiourea-hexanediamine as well as phenolic-diethylene triamine curing agent are prepared. In order to overcome the performance of a single curing agent less than a single, all of these modified curing agents are mixed to get the compounded curing agent. The analysis of curing properties and adhesive properties of the compounded curing agent has shown that the compounded curing agent is able to be effective bonded quickly in the conditions with water.After the studying on the water-absorbent filler and the compounded curing agent, we obtain the adhesive formula. In order to study the impact of various factors on the performance of the adhesive, a series of comprehensive tests and analysis are carried out. Finally, the fast-curing wet-bonding adhesive is modified by nano-SiO2 particles. The analysis has shown that when the adding amount of nano-SiO2 particles is 3%, the toughness of the fast-curing wet-bonding adhesive is greatly improved.
Keywords/Search Tags:wet-bonding, fast-curing, compounded curing agent, super absorbent resin, epoxy adhesive
PDF Full Text Request
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