Study Of The Interfacial Thermal Conductivity Of Metal Matrix Composites

Metal Matrix composites (MMC) have received substantial attention as Electronic Packaging Material, because of theirs properties: high thermal conductivity and low coefficient of thermal expansion. With the development of technology, it is necessary to improve the thermal conductivity of composite materials, in order to avoid excessive temperature buildup in device. The thermal resistance, which occurs at the interface between metal and reinforcement, decreases the effective thermal conductivity of composite.Scanning thermal microscope (SThM) can be used to image thermal properties of interface, for it can study thermal phenomena at nanometer scales. In this article, using SThM to study the thermal conductivity at the interface of composite (SiCpICu composite fabricated via Hot Isostatic Process (HIP), SiCp/AI composite fabricated via Pressureless Molten Infiltration Process and NiA1IAI composite fabricated via InSitu Process). Their interfacial thermal properties were compared and analyzed, and their interfacial conductivity was calculated.