Solidification Of Al-Si And Al-Cu Eutectic Alloys In Electric Field

The effect of electric field(direct current electric field and alternate current electric field) on the solidified structure of Al-Cu and Al-Si eutectic alloys is studied, mechanism of the solidifying behavior of Al-Cu and Al-Si eutectic alloys under electric field is discussed. The study shows: the solidifying point of the alloy is decreased and the degree of supercooling is improved at some extent due to the effect of direct and alternate current electric field, the nucleating rate of the alloy is increased and eutectic Si points increased in Al-Si alloy and the size of eutectic particles in Al-Cu decreased but quantities increased. The solidifying structure of Al-Si alloy is refined by the electric field, the eutectic Si change from flake-like structures to fine particles, the effect of direct electric field is more than altenative electric field, the clearance of the two phases is decreased by electric field. Due to the Al-Cu alloys, the eutectic lamellars are disturbed by the direct electric field and the degenerate eutectic structures appear due to the effect of altenative electric fields.