Study On The Elecroless Nickel Plating Without Palladium Activated Process On Engineering Plastics

In recent years, engineering plastics is one of fast developing industries. Compared with traditional plastics, it has special functions such as high mechanical intensity , excellent heat resistance , processibility, etc.When it is applied to the case of conductivity and electromagnetic shield, its surface metalation will be accomplished only by electroless plating. Since its surface activation procedure and components of electroless Nickel solution have been related to the occurrence of electroless plating, deposition rate and quality of deposits, that to develop new activation methods and new prescription of electroless plating solution would become the key for innovation of electroless plating. With a number of experiments in this paper, the elecroless Nickel plating without palladium activated process on engineering plastics is accomplished ultimately. Main results are summarized as below:1 .Based on heat-resistant substrates, the author has proposed a new method without palladium activated process which is an activated method of heat-reduced nickel salts, and abstained the activate solution mainly made of Nickel acetate, Sodium hypophosphite, alkaline ligand A and methanol. After absorbing some solution on the surface of substrate, a good precursor catalytic deposition—active nickel would be abstained with high temperature.