The Simulation Of Al-1.96%molCu Binary Alloy During Directional Solidification

The directional solidification technology is one of the most important methods in controlling the solidification structure of alloys. Since the directional solidification technology was becoming, more and more researchers are cured to explore it for its characters, which could get special direction and better properties to the materials. At the same time, as a new powerful tool for describing the complex pattern evolution of the interface between mother and new phases in non-equilibrium state, the phase-field model takes up a perfect situation on simulating the alloy directional solidification. It could simulate the solid-liquid interfacial morphology and predict the final directional solidification microstructures. Numerical simulation of alloy directional solidification is a new study field. Predicting the form of microstructures through the computer simulation, not only help to understand the machine-process of solidification structures, but also benefit to predict the physics properties of alloy directional solidification. Then achieving the goal is controlling the quality of alloy.In this paper, through the phase-field model simulating the Al-1.96%molCu binary directional solidification during the solid/liquid interfacial morphology in 2-D, it mainly studies the parameters of anisotropy intensity (η), the superfluous temperature (△T), thedisturb (16g(Φ)x~ω). These three different parameters should influence the microstructure of alloy directional solidification. Using the phase-field model theory and C code, coupling the phase-field equation and the solution diffusion equation, the phase-field model equations have been solved using the explicit finite difference method on a uniform mesh. This paper completes the phase-field simulation program to simulate the microstructure of alloy directional solidification, and achieves the vision of results with correlating the Tecplot software.The results of simulation predict that the parameter of anisotropy intensity is smaller and the tip velocity is smaller, the side-branches are prone to grow, and form cellular dendrites at the end; the superfluous temperature has a lot of effect to the cellular structure, with the superfluous temperature rising, the cellular structure is becoming thin, the radius of tips would be decreased; the disturb is playing an great role on influencing the interfacial morphology, when it is a proper value, the side-branches are appear on the column, the shrink of neck would be disappear at the liquid-solid interface, then cellular dendrites are becoming with the disturb increasing. Experimental study on the solidification process of Al-1.96%molCu alloy is used to validate the phase-field mold simulation with analysis.The paper studies the anisotropy in phase-field model in the theory. Furthermore, as two most important parameters, the growth and temperature gradient in the solid/liquid interfacial morphology during directional solidification, they have been investigated in principle and reviewed the present development condition in this area at home and abroad.